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MR18R1622AF0 Datasheet, Samsung semiconductor

MR18R1622AF0 a-die equivalent, (mr1xr1622(4/8/g)af0) (16mx16)x2(4/8/16)pcs rimm module based on 256mb a-die.

MR18R1622AF0 Avg. rating / M : 1.0 rating-12

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MR18R1622AF0 Datasheet

Features and benefits

256M x 16/18 -CN9 -CM8 -CK8
* High speed up to 1066 MHz RDRAM storage
* 184 edge connector pads with 1mm pad spacing
* Module PCB size : 133.35mm x 31.75mm .

Application

including computer memory, personal computers, workstations and other applications where high bandwidth and low latency .

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